Semiconductors are at the core of innovation

Semiconductors are at the core of innovation in today’s automobiles, enabling control and monitoring of the mission-critical components of the vehicle, including basic operation and efficiency, safety, advanced driver assistance systems, infotainment, and increasingly, autonomous driving capability. With thousands of ICs in a modern car, chip reliability has become the top quality concern for automakers. To enter the growing automotive market segment – or simply maintain share – IC manufacturers must aggressively tackle chip reliability requirements. Because chip reliability is highly correlated to random defectivity, defect reduction strategies produce chips with higher reliability.

Continuous Improvement Program

A continuous improvement program (CIP) leverages unpatterned wafer defect inspection to identify the specific process tools causing defects. With a tool monitoring CIP in place, automotive fabs can set objective targets for reducing the process defects that affect reliability.

Surfscan® Series

Zero Defect Screening

With Zero Defect Screening, fabs monitor 100% of die on all wafers at the critical process steps. This requires an inspector that is fast, sensitive and can reliably identify which defects matter. With this method, die that may fail are removed from the supply chain at the fab where cost is lowest.

8 Series

Certified & Relaunched

Advanced Design Node Inflection

With automotive features, such as machine vision and AI, requiring advanced ICs, fabs must attain higher yield and quality standards for advanced design node devices faster than ever before. This requires discovery of all systematic defect sources during safe launch, validation of the control plan and an "every defect matters" approach to improving baseline yield.

39xx Series

29xx Series

eDR7200™ Series

Packaged IC Quality

Screening and sorting of packaged IC components prevents defective devices from moving forward in the supply chain. Component inspection and metrology systems capture critical defects and variations that enable the continuous improvement of packaging processes, root cause determination of reliability-related issues and device failure traceability.

ICOS™ Series

Power Device Reliability

Implemented in a wide range of automotive subsystems, power devices require the same ppb quality standards as other automotive ICs. Specialized inspection systems for SiC substrates and SiC epitaxy and GaN-on-silicon processes help power device manufacturers achieve automotive defect standards.

Candela® CS920


I-PAT (Inline Defect Part Average Testing) is a new method that allows automobile manufacturers to reduce the incidence of latent reliability defects in semiconductor electronic components, recognize at-risk die for exclusion from the supply chain and reduce the incidence of escapes of die that will fail prematurely from the fab. (I-PAT patent pending)

Download the Paper

Automotive Workshops

KLA offers workshops to help semiconductor fabs, Tier 1 suppliers and automotive OEMs understand the best known methods for latent reliability defect reduction.

Find an Event

KLA Services

Finding all defects relevant to reliability requires inspectors that are in peak operating shape. KLA Services delivers the expertise to service highly complex inspection systems, ensuring automotive fabs achieve required uptime with uncompromising sensitivity.

Contact Us for More Information

Commentary and Papers

Semiconductor Engineering / May 2019
Gaps Emerge in Automotive Test

Automotive Electronics Council Reliability Workshop / Apr 2019
Toward Zero Defect: Automotive Fab Best Practices for Assessing "Best Performing Tools"

Automotive Electronics Council Reliability Workshop / Apr 2019
Practical Applications of "Measurement Systems Analysis" (MSA) for Semiconductor Process Control

Semiconductor Engineering / Apr 2019
Electric Cars Gain Traction, But Challenges Remain

ECN / Feb 2019
Reliability in Autonomous Driving Systems Starts with Pursuit of Zero Defects

Semiconductor Engineering / Feb 2019
Reliability Becomes The Top Concern In Automotive

Semiconductor Engineering / Jan 2019
Chasing Reliability In Automotive Electronics

Elektronik Automotive / Dec 2018
Zuverl?ssiger Einsatz von Halbleitern im Kraftfahrzeug

Solid State Technology / Nov 2018
Process Watch: Monitoring for Excursions in Automotive Fabs

Solid State Technology / Aug 2018
Process Watch: Automotive Defect Sensitivity Requirements

Chip Scale Review / Aug 2018
Automotive Apps Are Driving Inspection Requirements for Advanced Nodes

Automotive Electronics Council Reliability Workshop / Apr 2018
Inline Defect Part Average Testing (I-PAT)

Automotive Electronics Council Reliability Workshop / Apr 2018
Latent Reliability Defects in Automotive Chip Packages

Solid State Technology / Mar 2018
Process Watch: Baseline Yield Predicts Baseline Reliability

Semiconductor Engineering / Mar 2018
Finding Faulty Auto Chips

Semiconductor Engineering / Jan 2018
Automotive IC Industry Trends

Solid State Technology / Jan 2018
Process Watch: The (Automotive) Problem With Semiconductors

Semiconductor Engineering / Oct 2017
Radar Versus LiDAR

Evaluation Engineering / Oct 2017
Autonomous Vehicles, New Tech Drive Automotive Test Market

Semiconductor Engineering / Sep 2017
Foundries Accelerate Auto Efforts

KLA-Tencor is now KLA

We've updated our look to match who we are as a company —
innovators and optimists
pushing the bounds of technology every day.

Continue to the site
Visit our Vision Page

Are you sure?

You've selected to view this site translated by Google Translate.
KLA China has the same content with improved translations.

Would you like to visit KLA China instead?